WLCSP market and industrial trends

According to Yole Developpement, France, the number of devices packaged with 'fan-in WLCSP will exceed 25 billion units in 2012, exceeding more than 2 million 300mm equivalent wafers. Yole recently held a seminar on wafer level chip scale package (WLCSP).Source: Yole Developpement, France.Yole estimates the fan-in WLCSP industry value to be over $1.9 billion in 2012. This includes wafer level